Wet-Blast® (WBM)

HARD GRADE

GRANULATED PLASTIC MEDIA

For Wet – Blast Deflashing of Integrated Circuits and Discrete Electronic Components

SPECIFICATIONS

Part No. Sieve Size Inches Millimeters
WBM – 2 20/30 .033 – .023 .84 – .58
WBM – 3 30/40 .023 – .017 .58 – .42
WBM – 4 40/60 .017 – .010 .42 – .25
WBM – 5 60/100 .010 – .006 .25 – .15

FOR REFERENCE:

• SPECIFIC GRAVITY = 1.5 gms/cc (Glass Bead = 2.5)
• HARDNESS = 4.0 MOHS (Glass Bead = 5.5)
• NOTE: Custom sizing and special screening are available. Please inquire.

 

FEATURES AND BENEFITS

  • WBM is harder and denser than other plastic media resulting in more efficient deflashing, superior sedimentation and excellent media circulation.
  • WBM is softer and less abrasive than glass bead and, therefore, doesn't damage parts and causes no excessive wear to deflashing machinery.
  • WBM is offered in a wide range of standard sizes so that the ideal size is available for each individual application.
  • WBM features tight size control which excludes ineffective, dusty fines and oversized particles from media mix.